What is GOB Packaging Technology?
GOB packaging is a packaging technology launched to address the protection issues of LED lamp beads. It uses advanced transparent materials to encapsulate the PCB substrate and LED packaging unit to form effective protection. It is equivalent to adding a layer of protection in front of the original LED module, so as to achieve high protection functions and achieve the effects of waterproof, moisture-proof, impact-proof, anti-bump, anti-static, anti-salt spray, anti-oxidation, anti-blue light, and anti-vibration.
1. Fully Automatic Connection Screen Display：There are sensing points on the side of the cabinet, and users only need to plug in the power cord and signal line. cabinets can be joined horizontally or vertically. no manual intervention is required, content is displayed completely automatically, and technicians no longer need to operate complex debugging and setting software on site.
2.Lightweight Design：Integrated lightweight deployment,ultra-light and ultra-thin design,weighs only 2.33 kg.
3.Magnetic Installation：The magnetic suction design on both sides of the cabinet makes the installation more convenient and faster.
4.Integrated Design：Integrated module, receiving card and power supply.there are reserved power interfaces and network cable interfaces to reduce the number of external cables and make the overall system more concise.
5.Good Display Effect：This module has built-in specific LED light types, true color line display, 3840Hz high refresh rate, 16-bit grayscale,the viewing angle can reach 140°.
6.Creative Splicing：Users only need to install any cabinet to any position, and then the entire screen can be displayed on the large screen. Even creative splicing in the shapes of "Mountain", "L" and "Tian" can be displayed automatically without any debugging.
